ALPHA?OM-350 是一種無(wú)鉛免清洗焊膏，適合精細(xì)特征印刷以及在空氣和氮?dú)猸h(huán)境中使用最嚴(yán)苛的保溫回流曲線的回流。ALPHA OM-350 出色的回流工藝窗口在 OSP 銅、浸銀、浸鋅、ENIG 和無(wú)鉛 HASL 飾面提供了良好的焊接效果。ALPHA OM-350 符合 ROL0 IPC 和 IPC III 類(lèi)空洞分類(lèi)，確保最大程度提高長(zhǎng)期產(chǎn)品可靠性。符合環(huán)境標(biāo)準(zhǔn)，包括 RoHS，可在全球范圍內(nèi)使用 ALPHA OM-350。
特點(diǎn)和優(yōu)勢(shì)
- Excellent Pin-in-Paste (Paste-in-Hole) Performance: demonstrated both for printing, dispensing (or pin transfer) SMT applications.
- Long Stencil Life: consistent performance for at least 6 hours of continuous printing without addition of new paste. 24 hour SMT production ability achieved from 20oC up to 32oC (68oF - 90oF) harsh environments.
- Stable Paste Viscosity: allows wide storage and handling window at temperatures up to 30oC for 21days,and up to 25°C for one month.
- High Tack Force: ensures high pick-and-place yields, good self-alignment and a low tomb-stoning defect rate.
- Wide Reflow Profile Window: allows best quality solderability of complicated, high-density PWB assemblies in both air and nitrogen reflow, using straight ramp or soak profiles up to 200°C.
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- Robust Solderability: proven to handle difficult wetting requirements of critical lead-free components, such as CSP and QFN…etc. on a variety of lead-free board finishes, OSP-Cu, Immersion Ag, Immersion Sn, ENIG & LF HASL.
- Reduced Random Solder Ball Levels: minimizes rework and increases first time yield.
- Voiding Performance: meets highest IPC classification of Class III for important ball grid array components.
- Excellent Solder Joint and Flux Residue Cosmetics: after reflow soldering even using long/high thermal soaking without charring or burning.
- First-rate Reliability Properties: excess variety of industry and customer standards, halide free material graded ROL0 according to IPC classification.
- Safe and Environmentally Friendly: materials comply with RoHS requirement, as well as TSCA & EINECS
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